In addition it can also reshape existing

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For example, in chips, the most obvious increase in AI end-side applications in the chip field will be computing power and storage. In the future, the end-side will add computing functions, which will also increase the amount of data stored on the end-side, and the corresponding storage chip capacity will also start to be upgraded. It will benefit domestic storage and module manufacturers such as GigaDevice, Puran Technology, and Baiwei Storage.

T and consumer electronics devices, including mobile phones, computers, wearables and various IoT devices. The introduction of AI functions can stimulate the demand for replacement devices.

Apple Intelligence, which was first launched in North australia whatsapp mobile phone number list America in October last year, has successively expanded its use areas and may gradually be launched in China, France, Japan, Spain and other regions next year. Apple SE4 is also expected to be released in March next year. It is said that the iPhone 17 Slim released next year may be the biggest appearance change in ten years.

In the future, as the usage rate of end-side AI increases, the demand for computing power will pose greater challenges to the chip industry chain, especially advanced packaging production capacity.

According to TSMC, the current CoWOS monthly production capacity has reached a new high of 75,000 wafers, which is doubled compared to last year. However, customer demand is now too strong and supply will still be tight next year. TSMC’s market value, including the increase in foundry prices, is continuing to hit new highs.



In addition to smart wearables, the best mapping direction for AI is humanoid robots, which is another hot topic at the exhibition. A number of humanoid robot products are expected to be unveiled at CES2025.

Huang Renxun introduced the list of partners cooperating with Nvidia, including domestic manufacturers Yushu Technology humanoid robot H1 and Xpeng Automobile humanoid robot Laotie.